Product Overview

BPM (Bismaleimide Monomer with Indane Structure) is a high-performance specialty thermosetting resin monomer engineered for next-generation 5G/6G high-frequency, high-speed copper-clad laminates (CCL), advanced electronic packaging, and aerospace structural composites. By integrating a rigid, bulky, and non-coplanar phenylindane skeleton into the bismaleimide backbone, BPM effectively disrupts molecular symmetry—dramatically enhancing solubility and reducing dielectric loss while preserving exceptional high-temperature resistance and mechanical rigidity.

Typical Physical & Chemical Properties

Cured Resin Performance (Typical Reference)

Note: Data obtained from a standard thermal-cured system (BPM co-cured with reactive modifiers).

Key Advantages & Processing Benefits

· Ultra-Low Signal Distortion: Bulky indane rings increase free volume and lower polarizability, ensuring exceptional Dₖ/D_f stability across gigahertz frequencies.

· Superior Solvent Compatibility: Readily soluble in eco-friendly and standard electronics solvents (e.g., MEK, Acetone, Cyclohexanone, NMP), enabling stable, high-solid-content varnish formulations without crystal precipitation.

· Excellent Co-curability: Exhibits broad processing windows and excellent compatibility with allyl compounds (such as DABPA), epoxy resins, and cyanate esters for interpenetrating polymer network (IPN) modifications.

· Strict Electronic Grade Control: Minimized ionic residues (Cl⁻, Na⁺) to prevent ion migration and ensure long-term PCB reliability.

Recommended Applications

· 5G/6G High-Frequency, Low-Loss CCL & Multi-Layer PCBs

· High-Temperature Insulating Varnishes & Electronic Packaging Adhesives

· Advanced Aerospace Heat-Resistant Composite Matrices

Packaging, Handling & Storage

· Packaging: 20 kg / 25 kg fiber drum lined with moisture-proof polyethylene bag.

· Storage: Store tightly sealed in a cool, dry, dark, and well-ventilated area away from direct sunlight, heat sources, and moisture.

· Shelf Life: 12 months from the date of manufacture.